Abstract

Crystalline silicon (c-Si) surface passivation has been investigated by sputtered hydrogenated intrinsic amorphous silicon (S-i-a-Si:H) and thermally evaporated molybdenum oxide (MoOx) thin films. The temperature- and injection-dependent lifetime spectroscopy technique has been adopted for analyzing the passivation quality of the c-Si surface, using parameters such as the minority carrier effective lifetime (τeff), the activation energy of surface/interface defect states (ΔE), and the electron to hole carrier capture cross-section ratio (k) at the interface. With S-i-a-Si:H films, a τeff of ∼70 µs and ΔE of ∼51 meV have been observed in comparison to a τeff of ∼110 µs and ΔE of ∼109 meV from the MoOx films. These entirely different parameters are an indication of the relatively strong carrier recombination with dense interface/surface states from the S-i-a-Si:H passivation layers. The S-i-a-Si:H layers are unable to minimize the c-Si surface trap states with the chemical passivation for reducing carrier recombination due to the generation of additional surface defect states by the sputtering damage. However, the MoOx layers show better c-Si surface passivation due to the reduction of majority carriers by the carrier inversion (field-effect passivation) and chemical passivation. This effect is clearly reflected with the opposite trend in the carrier capture analysis from S-i-a-Si:H and MoOx layers.

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