Abstract
We studied thin film growth of Cu on Cu (111) surface by molecular dynamics (MD) simulations using the Embedded Atom Method (EAM) potential and an incidence energy of 0.06 eV at 300 K. At the beginning of the deposition, we observe a coexistence of atoms nucleated on hcp and fcc sites in the first layer. The connection of these islands produces a border zone in rectangular form. The coexistence of fcc and hcp geometries has generated energy competition and eventually transitioned to fcc sites implying a large collective movement of several layers. However, the transition to the coexistence of these two structures, can promote coalescence by linking two large mounds.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.