Abstract
Parameters of grain-boundary ensembles of Cu-Al and Cu-Mn solid solutions are analyzed quantitatively by optical metallography and scanning electron microscopy with the use of backscattering electron diffraction. It is established by both methods that the fraction of all special boundaries in a grain boundary ensemble and the fraction of twin boundaries Σ3 in the spectrum of special boundaries increase as the tacking fault energy in substitutional solid solutions diminishes.
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