Internal mechanical stresses and the thermodynamic and adhesion parameters of the metal condensate-single-crystal silicon system

Abstract

The kinetics of generation of internal mechanical stresses σ(d) in chromium, copper, gold, and aluminum thin films on single-crystal silicon substrates at different deposition rates has been experimentally investigated using the cantilever method. A two-step character of the variations in internal tensile stresses has been revealed. The regularities of the formation of the maximum level of mechanical stresses in the condensates under investigation have been established. The energy and adhesion parameters of chromium, copper, gold, and aluminum nanolayers on silicon, germanium, and nickel substrates have been studied using the macroscopic methods of surface physics. The interfacial energy, interfacial tension, work of adhesion, interfacial charge, and a new energy characteristic of the interfacial layer, namely, the energy of adhesive bonds, which exceeds the interfacial energy, have been determined.