Abstract
The existence of an intergranular precipitate that provides a structural basis of creep, intergranular corrosion and thermal instability in dental amalgams has been in dispute. Also in dispute is a related matter concerning the solid solubility of Sn in ϒ1. Both these aspects have been examined in this differential scanning calorimetry (DSC) study using the following materials: (a) a conventional ϒ2−containing amalgam, (b) six ϒ2−free amalgams, and (c) a series of ϒ1 specimens with up to 4 wt% Sn. It has been observed that the solid solubility of Sn in ϒ1 is about 1.0 wt%. Above this Sn concentration, an intergranular precipitate, identified as the δ2 phase of the SnHg system, appears in ϒ1. This phase is characterized by a low melting temperature (∼90°C). The existence of this phase in the conventional dental amalgam has been confirmed. It has been observed further that the ϒ2−free dental amalgams, depending on their nature and Hg contents, may contain δ2 either as a transient or a permanent phase.
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