Abstract
This study investigated the interfacial reactions between Sn-4.0Ag-0.5Cu (wt.%) (SAC405) and Sn-4.0Ag-0.5Cu-0.05Ni-0.01Ge (wt.%) (SACNG) lead free solders with an Au/Ni(P)/Cu substrate reflowed using the CO2 laser and hot-air methods. A mixture of two intermetallic compounds, (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 phases, was formed at the interface when the solder/substrate couples were reflowed using the CO2 laser. When the specimen was aged at 150°C, the thickness of the (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 phases increased as the aging time increased. The (Cu, Ni)6Sn5, (Ni, Cu)3Sn4, Ni–Sn–P and Ni3P phases were formed at the interface when the specimens were reflowed using the hot-air method at 240°C and aged at 150°C for a long reaction period. Due to a rapid cooling-rate in the CO2 laser reflowing system, solidification phases with finer microstructure were found in the solder matrix.
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