Interfacial Modification of Ti3AlC2/Cu Composites by Multi-Arc Ion Plating Titanium

Abstract

Cu matrix composites reinforced with Ti3AlC2 ceramics can be applied for electrical contact materials, such as vacuum contact material or a pantograph slide plate. However, Ti3AlC2 particles substantially decomposed because lattice diffusion is the main way that Al atoms diffused into the Cu matrix and were uniformly distributed. In order to suppress the decomposition of Ti3AlC2 ceramics and improve the properties of Ti3AlC2/Cu composites, the surface of Ti3AlC2 was modified by multi-arc ion plating Ti. The results shows that, with the volume fraction increasing of Ti3AlC2, the decomposition of Ti3AlC2 is exacerbated and the lattice constant of Cu(Al) solid solution is bigger. In the meanwhile, the structure of Ti3AlC2 changes from dispersed granules to flakes, then to a continuous network. Multi-arc ion plating Ti effectively inhibits the diffusion of Al atoms into Cu matrix. The Ti coating reacts with Cu and generates CuxTi in the interface between the Cu and Ti coating, which inhibits the diffusion of Al atoms so as to inhibit decomposition., the inhibition of decomposition of Ti3AlC2 ceramics weakened solid solution strengthening and decreased the content of hard phase TiCx. Furthermore, the good mutual diffusion between CuxTi layer and Cu effectively improves the interfacial bonding strength.