Abstract
In this work, interfacial microstructure in W/2024Al composite and inhibition of the W-Al direct reaction by CeO2 doping were investigated. The composites were prepared through powder sintering, and after preparation the composites were treated by annealing at 823 K. For the prepared W/2024Al composite, a multi-phase thin layer composed of WAl12 and WAl5 compounds were formed at the interface due to the W-Al direct reaction. While doping CeO2 in the composite, Al-Ce-Cu-W amorphous substituting of W-Al compounds were formed at the interfacial reaction layer. In an annealed state, the composite with CeO2 doping shows a significant inhibitory effect on W-Al compounds, which was attributed to the crystallized layer that evolved from Al-Ce-Cu-W amorphous as an interfacial obstacle. The crystallization product for Al-Ce-Cu-W amorphous layer was identified as bcc-structure Al-Ce-Cu-W phase without any binary/ternary Ce-containing phases. Therefore, by doping CeO2 in W/2024Al composite, W-Al direct reaction was markedly inhibited during both preparation and annealing.
Highlights
The interfacial microstructure has played effective and important roles in the exploration of particle reinforced aluminum matrix composites (PRAMC) and improvement of their thermal stability, mechanical and physical properties
A number of researchers have attempted to optimize the interfacial structure of PRAMC used for many applications such as multifunctional electronic packaging [1], thermal management [2], transport industry [3,4], aerospace industry [5,6], and so on
W/2024Al composite, which could be used for radiation shielding with a relative lower density, has attracted more attention in the interfacial microstructure because of its possible reactions at the W/Al interface during preparation and annealing
Summary
The interfacial microstructure has played effective and important roles in the exploration of particle reinforced aluminum matrix composites (PRAMC) and improvement of their thermal stability, mechanical and physical properties. W/2024Al composite, which could be used for radiation shielding with a relative lower density, has attracted more attention in the interfacial microstructure because of its possible reactions at the W/Al interface during preparation and annealing. Most of the W-Al intermetallic compounds (e.g., WAl12 , WAl5 ) are brittle and will deteriorate the mechanical properties of composites as interfacial reaction products. The formation of W-Al interfacial compounds could lead to the obvious volume expansion of composites, i.e., poor thermal stability.
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