Abstract
A thick gold deposition has been used for metallic contact to GaxIn1-xSb. On a diode arrangement, the interdiffusion of these elements has been studied with heat treatment at 200°C. Only Ga and In diffuse out of the initial interface into the gold top layer, where they form stable compounds. The depth distribution profiles show that the microalloying takes the form of a layered structure of fixed intermetallic phases.
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