Abstract
The sintering of randomly oriented copper nanoparticles in the size range 4–20 nm with a single crystal (001) copper substrate has been studied in real time using a novel in situ ultrahigh vacuum (UHV) transmission electron microscope. The particles were generated in situ using an UHV DC sputtering attachment and deposited directly onto an electron transparent copper foil inside the microscope. We demonstrate that these particles reorient upon heating to assume the same orientation as the substrate by a classical mechanism involving neck growth and grain boundary motion.
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