Abstract
This paper describes an innovative system integration scheme wherein heterogeneous materials and devices, including photonic devices as well as electronics, are organically integrated on silicon-core circuitry to achieve better performance, higher functionality and lower cost. First, some general integration technology trends in semiconductor electronics are described. Then, after a discussion of new heterogeneous integration schemes based on silicon-core technologies, recent attempts and applications are shown such as low power LSIs, sensors and micromachine switches on silicon and milimeter-wave photonics.
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