Abstract
A convenient method has been developed that provides for applying patterned copper tracks on flexible polyimide film for electronic applications. The workflow comprises inkjet printing of an aqueous palladium(II) solution onto surface treated polyimide film, followed by reduction to metallic palladium and electroless copper plating. All processing steps involved require minimal infrastructure and result in metallic feature dimensions down to 100 μm using a desktop inkjet printer. Ink stability is documented by UV/vis, and copper line dimensions and electrical resistivity are examined as function of design dimensions and electroless plating time. The procedure was successfully applied for manufacturing interdigitated electrode films as used in active fiber composites.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
