Abstract

Initial stages of copper electrocrystallization on glassy carbon from sulfuric acid electrolytes of pH 0.3 and 3.7 are studied by the method of potentiostatic current transients on rotating and stationary ring–disk electrode. The rate of copper deposition in a 0.5 M Na2SO4 + 0.01 М CuSO4 (pH 3.7) solution is marginally higher than in a 0.5 M H2SO4 + 0.01 М CuSO4 acid electrolyte (pH 0.3) at the expense of adsorption of sulfate and hydroxide ions on the substrate surface and the copper crystals. Regularities governing the multistage discharge of copper ions, the formation of the new phase nuclei, and the deposit dissolution are analyzed. The results of the study are compared with the data on the kinetics of copper electrocrystallization on a platinum electrode. The acceleration of the copper deposition on glassy carbon in the acid solution of pH 0.3, as compared with platinum, is due to accelerated discharge of copper ions and increased number of univalent copper ions in the near-electrode layer of solution. The oxygen-containing surface groups of glassy carbon (quinone–hydroquinone, carbonyl, etc.) are probably active centers for the discharge of copper ions and three-dimensional nucleation.

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