Abstract

AbstractTwo types of isomeric bi‐DOPO(9,10‐dihydro‐9‐oxa‐10‐phosphaphenan threne‐10‐oxide) flame retardants named DHK(6,6’‐((4,6’‐dihydroxy‐[1,1’‐biphenyl]‐3,3’‐diyl)bis(propane‐3,1‐diyl))bis(dibenzo[c,e][1,2] oxaphosphinine 6‐oxide)) and DMG (6,6’‐((6,6’‐dihydroxy‐[1,1’‐biphenyl]‐3,3’‐diyl) bis (propane‐3,1‐diyl)) bis (dibenzo [c,e][1,2] oxaphosphinine 6‐oxide)) are successfully prepared and their flame retardant properties are investigated. Although they have the same phosphorus content, the corresponding thermoset DHK/Epoxy resins (EP) and DMG/EP show different flame retardancy. The flame retardant mechanism is compared by thermal analysis coupled with Fourier transform infrared (TG‐FTIR), residue FTIR, elemental analysis, Raman spectra, scanning electron microscopy (SEM), and cone calorimetry. More phosphorus remains in the residue of DHK/EP which suggests better‐condensed phase flame retardancy than that of DMG/EP. However, DMG shows a better flame inhibition effect than that of DHK. The results of mean square displacement, free volume fraction, and cohesive energy density in molecular dynamics simulations show that the weakening of the movement ability of the DMG/EP molecular segments should be the reason for the increase in toughness. This shows that although flame retardants possess the same composition, their structure will also affect their flame retardant mechanism and properties, which provide a guide for the design and preparation of high‐efficiency flame retardants.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.