Influence of temperature and humidity on adhesion of underfills for flip chip packaging

Abstract

This paper systematically discusses the influence of temperature and humidity on the adhesion performance of underfill material (epoxy cured with acid anhydride), evaluated by die shear test after exposure to various conditions. The adhesion strength between the underfill and passivation is not affected significantly by thermal cycling between -55/spl deg/C and 125/spl deg/C for 1000 cycles. The adhesion strength of underfill material decreases with the increase of test temperature above room temperature, due to the decrease of modulus of the underfill with the increase of temperature. A sharp decrease in adhesion strength occurs as temperature increase towards the glass transition temperature of the underfill material. Adhesion strength of underfill with different passivation materials decreases after aging in a high temperature and high humidity environment. The extent of this decrease is dependent on the chemistry of underfill formulation and the hydrophilicity of the passivation material. Hydrophilic passivation such silicon oxide (SiO/sub 2/) and silicon nitride (SiN) shows much more severe adhesion degradation than hydrophobic passivation such as benzocyclobutene (BCB) and polyimide (PI). Adhesion degradation kinetics is discussed in terms of mobility of polymer chains and of absorbed water. The adhesion stability for hydrophilic passivation can be successfully improved by use of a coupling agent such as silane that introduces stable chemical bond at interface.