Abstract

The influence of interface recombination on the electroluminescence profile of a lateral p+/p/n+ light emitting diode fabricated on Silicon On Insulator (SOI) materials has been experimentally investigated. Our device resembles a MOSFET fabricated on SOI, except that the source region has opposite doping to the drain. By controlling the voltage bias at the poly gate on top of active emitting region in association with a bias on the silicon substrate under the active region we were able to diminish the non-radiative recombination component at Si/SiO2 interface and therefore enhance the radiative recombination in the thin film SOI. When the diode is working under constant current condition, we observe an increased light output of ~ 20 % as the gate and/or the substrate are biased negatively. The intensity profile across the device is also strongly influenced. To understand the device thoroughly, the structure has also been simulated showing agreement with experimental results.

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