Abstract
This study investigated the effect of the filler particle size (micron or submicron) of experimental resin cements on the microtensile bond strength to a glass-ceramic pretreated with hydrofluoric acid (HFA) etching or alumina airborne-particle abrasion (AA). Cements were obtained from a Bis-GMA/TEGDMA mixture filled with 60 mass% micron-sized (1 ± 0.2 µm) or submicron-sized (180 ± 30 µm) Ba-Si-Al glass particles. Ceramic blocks (PM9; VITA) were treated with 10% HFA for 60 s or AA for 15 s. Silane and adhesive were applied. Ceramic blocks were bonded to resin composite blocks (Z250; 3M ESPE) using one of the cements. Bonded specimens were sectioned into beams (n = 20/group) and subjected to microtensile bond strength tests. Data were analyzed using ANOVA and Student-Newman-Keuls' tests (5%). Failure modes were classified under magnification. Morphologies of the treated ceramic surfaces and bonded interfaces were evaluated by scanning electron microscopy. The HFA-submicron group had lower bond strengths than the other groups. All AA-submicron specimens debonded prematurely. Mixed failures were predominant for HFA groups, whereas interfacial failures predominated for AA groups. SEM revealed a honeycomb-like aspect in the HFA-treated ceramic, whereas the AA-treated groups showed an irregular retentive pattern. Continuity of cement infiltration along the bonded interface was more uniform for HFA-treated compared to AA-treated specimens. Cracks toward the bulk of the ceramic were observed in AA-treated specimens. Particle size significantly influenced the ceramic bond strength, whereas surface treatment had a minor effect.
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