Abstract
AbstractThe curing behavior of a phenolic resol resin in the presence of p‐toluensulphonic acid is reported herein. The gel time of different systems has been determined by thermal scanning rheometry. Thermal and mechanical properties of the resin have been modified by the addition of varying amounts of fillers, talc, and kaolin. dynamic mechanical thermal analysis is used to determine the mechanical properties of the systems and the influence of the fillers and the postcuring. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008
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