Abstract
This article deals with the impact of different shapes of apertures in stencil on the insulation distance and shear strength of joints glued by adhesives „MG 8331S” and Hysol CA3150” on rigid substrates FR-4. These joints were formed by adhesive assembling of chip resistors 0805. Nine different shapes of apertures in stencil were used for this experiment. These differences have an effect on the quantity of conductive adhesives which is used on the samples and an effect on the insulation distance between pads. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030 and insulation distance was measured after this test. This article presents the effects of different shapes apertures in stencil and different quantities of adhesives on the mechanical strength of the joint and the insulation distance between pads.
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