Abstract
With the optimal mass ratio (9/1) of 100 nm–1 μm particles, the bonding layer showed a highly dense sintering structure and was thinner than that of only 100 nm particles, the shear strength of the Cu-Cu joint was over 20 MPa even at relatively low temperature 250 °C and pressure of 4 MPa. The sawtooth structure formed between the bonding layer and the copper substrates can increase the bonding area and further promote the shear strength of joint, the optimal surface roughness of copper substrate for maximum enhanced effect was Ra = 189.9 ± 5.4 nm.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
