Abstract
In microelectronic field, 3D interconnects are processed by copper electrodeposition with the assistance of additives in order to promote a superfilling effect. The role of the different additives and the interaction between them and also with the copper ions are well described in the literature and by the CEAC model. However, few research works have been dedicated to the additives incorporation throughout the copper layer. Therefore, this study was focused on the additive trace detection by XPS and SIMS measurements and the impact of the applied waveform on the incorporation rate.
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