Abstract
AbstractThe continuous scaling of transistors has led to unprecedented challenges for interconnect technologies. Conventional barriers fail when thinned below 4 nm; therefore, novel materials and back‐end‐of‐line (BEOL) compatible synthesis are urgently needed. 2D transition metal dichalcogenides present a unique opportunity for addressing the scaling of interconnects. Here, nanometer thick Nb‐incorporated MoS2 is successfully synthesized at BEOL compatible temperatures and their abilities of blocking Cu atom diffusion are investigated. Nb incorporation of MoS2 is systematically studied at 450 °C and its growth dynamics is compared with those carried out at high temperatures. The addition of a few percent Nb in MoS2 enhances breakdown time by more than 100×, reaching a failure time >12 500 s under the electric field of 7 MV cm−1. These results suggest that integration of Nb‐incorporated MoS2 in electronic technologies is a promising route for the sub‐5 nm technology node.
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