Abstract
Reported here are in situ scanning tunneling microscopy (STM) results of underpotential deposition (UPD) of copper at an iodine-modified Pt(100) electrode. The cyclic voltammograms reveal that an iodine adlayer strongly adsorbed on Pt(100) resulted in a 350 mV delay of Cu deposition with respect to that of a bare Pt(100) electrode. High-quality in situ STM imaging reveals the atomic structures of the iodine adlayers before and after the deposition of Cu adatoms. Depending on the dosage of iodine vapor to an annealed Pt(100) electrode, two ordered structures of the iodine adatoms are formed and are characterized as ( × 5 )R45° and ( × 9 )R45° with coverage of 0.6 and 0.55, respectively. The predominant inter-adsorbate interaction results in adsorption of iodine at either symmetric 4-fold or asymmetric sites. Since the Cu deposit displaces the iodine adatoms on Pt(100), the iodine adatoms with weaker surface bonding are replaced first, leading to anisotropic deposition. Regardless of the initial iodine stru...
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