Abstract
Results of in situ measurements of the thermomechanical properties of polyimides used in the microelectronic packaging industry are presented. During the formation of polymer layers and their subsequent use, there are several thermomechanical effects which can affect the electronic packages performance. Specifically, thermal loading of the structure results in elastic and inelastic effects such as relaxation. The time and temperature dependent relaxation behavior of polyimides in multilayer structures were investigated to determine their thermomechanical properties. Both a numerical model and experimental analysis were used to determine the curvature change of multilayer structures during manufacturing. The numerical model, which is based on Maxwell's model, characterizes the stress relaxation behavior of thermoplastics. The changes in stress over time for quartz-polyimide-aluminum and quartz-polyimide-germanium heterostructures were obtained. From these observations, the relaxation time constant, activation energy, and viscosity-to-shear-modulus ratio were determined for the polyimide.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Components and Packaging Technologies
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
