Abstract
We suggest that a transparency resin sheet with low refractive index can be applied to the measurement of a silicon dioxide (SiO2) film on a silicon wafer under wet condition for a film thickness measurement system on chemical mechanical polishing (CMP). By adjusting the refractive indices of the resin sheet and water, stable measurements of the SiO2 film can be expected, irrespective of slurry film thickness fluctuation because it has robustness against the slurry film. This result indicates that the transparency resin sheet with low refractive index is a useful for monitoring system of CMP.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
