Abstract
In electrical discharge machining, in-process measurements of the induced mechanical stress are essential to develop process models for improving the fatigue strength of the machined part. For this purpose, high-speed digital speckle photography is introduced to measure the workpiece-side load fields with a lateral displacement resolution of 28 nm at a spatiotemporal resolution of 29 µm and 40 µs, respectively. As a result, the load effects of even individual 100 µs short discharge pulses are temporally resolved for the first time, and the occurring spatial load inhomogeneities and their dynamics are characterized to complement our understanding of the machining process.
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