Improving formability of copper by addition of graphite

Abstract

Our Project aims to demonstrate the softening process of annealing of copper in an appropriate furnace at an optimum temperature. Copper is soft at its initial state and needs to be bended for various applications and used to the desired shape. Upon bending, Copper tends to have voids development that results in crack formation and make the sheets unusable. Annealing is therefore performed at a temperature high enough usually at 400 DC that causes a new, strain-free material to form and Copper to return to its original soft condition and make the voids in the most compact state. Further on the introduction of graphite would fill up these voids and improve the formability of copper and overall machinability of copper that could be visibly seen by smaller chip formation which machines the surface. Graphite being a conductor itself will not reduce the C of Copper to a large extent so the composite mode can be used as a conductor in place of pure copper. This will also improve the usage of copper in various industrial searches where bending has to be performed without compromising on the crack formation and improve formability. This composite would also be able to handle high temperature working conditions better than pure copper as graphite tends to have a high MP that would also require high Pr.