Abstract
Two kinds of composite lead-free solders were prepared by adding Mo nanoparticles in Sn3.0Ag0.5Cu and Sn58Bi alloys, respectively. It was found that the microstructures of both composite solders were refined and the hardnesses of solders were significantly enhanced due to the addition of Mo nanoparticles. The mechanism of the effects of Mo nanoparticles on the microstructure and hardness was analyzed.
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