Improvement of the Quality by the Cold Plasma on the Sunn Pest (Eurygaster Integriceps)-Damaged Wheat Flour

Abstract

This study aimed to improve the quality of wheat flour affected by sunn bugs (Eurygaster integriceps) by examining the effects of cold plasma on its physicochemical and dough rheological properties. The sun-damaged wheat flour was treated with Surface Dielectric Barrier Discharge using atmospheric air cold plasma at different application times. The results demonstrated that sedimentation volumes increased with longer plasma treatment times and maximized in 60 seconds of treatment without causing any sunn pest damage. The alveograph tenacity (P) increased with plasma application, and as a result, the energy (W) reached approximately three times that of the application of 60 s. The values obtained for W and gluten balance (P/L) indicated that the dough's qualities were now appropriate for resulting in bread. Significance of the study • Atmospheric air cold plasma was applied to sunn pest-damaged wheat flour to improve the technological quality at three application times • Sedimentation volumes increased a level that did not cause any sunn pest-damage in 60 s of treatment • Plasma application increased the alveograph tenacity (P) • The alveograph energy (W) value reached aproximately three times in the application of 60 s. • The alveograph W and gluten balance (P/L) values of the dough became suitable for bread-making