Improved Fabrication of Micro Channels in LTCC Circuitry and MEMS Using QPAC® Polyalkylene Carbonate as a Sacrificial Structure

Abstract

QPAC® Polyalkylene carbonates polymers are currently used as a sacrificial material in many applications because they decompose at very low temperatures and leave virtually no contamination or residual behind after the debind step. This includes applications for air gaps in microfluidics, micro electro mechanical systems and microelectronics. QPAC® decomposition properties are very critical in applications with temperature sensitive materials or where residuals can cause electrical and or mechanical problems in the final product. Past work by academia and industry has been done with QPAC® to make enclosed air channels by providing temporary scaffolding in the pattern of the air gap. There are several methods of forming a cavity in an electronic device. This includes removal of the sacrificial material by thermal decomposition and wet etching. Thermal decomposition is the method employed to form the cavity using QPAC®. The results have been promising and show that this is a viable method to fabricate air gaps in Microelectromechanical, MEM systems and LTCC modules. Several new Polyalkylene carbonate polymers have recently been commercially produced to support further growth into this area.