Abstract
The power law creep behaviour of the Sn–40Pb–2·5Sb peritectic solder alloy was investigated using an impression test apparatus. The tests were carried out under constant stress in the range 17 to 39 MPa and at temperatures in the range 296 to 363 K. Assuming a power law relationship between the impression velocity and stress, power law stress exponents in the range 1–3 were determined. Analysis of the data showed that for all loads and temperatures, the activation energy was stress independent with values in the range 51–56 kJ mol-1. Based on the stress exponents obtained and activation energy data, it is proposed that grain boundary diffusion is the major mechanism for creep of the Sn–Pb–Sb peritectic alloy under these test conditions.
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