Abstract

In the present study, microstructure and creep behavior of an Al–1.9%Ni–1.6%Mn–1%Mg alloy were studied at temperature ranging from 493 to 513K and under stresses between 420 and 530MPa. The creep test was carried out by impression creep technique in which a flat ended cylindrical indenter was impressed on the specimens. The results showed that microstructure of the alloy is composed of primary α(Al) phase covered by a mantle of α(Al)+Ni3Al intermetallic compound. Mn segregated into AlxMnyNiz or Al6Mn phases distributed inside the matrix phase. It was found that the stress exponent, n, decreases from 5.2 to 3.6 with increasing temperature. Creep activation energies between 115kJ/mol and 151kJ/mol were estimated for the alloy and it decreases with rising stress. According to the stress exponent and creep activation energies, the lattice and pipe diffusion- climb controlled dislocation creep were the dominant creep mechanism.

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