Abstract
This work systematically investigated the effect of high-[Formula: see text] oxide materials on the performance of InAlN/GaN heterostructure underlap double gate (DG) MOS-HEMTs by considering 2D Sentaurus TCAD simulation. During the course of simulation, hydrodynamic mobility model was implemented and the obtained results were used for validating the model with the previously published experimental results. Different device performance parameters are thoroughly studied for different high-[Formula: see text] oxide materials by performing extensive simulations. It is verified that short channel effects (SCEs), key analog and RF figures of merits parameters and [Formula: see text]th improved with an increase in the value of high-[Formula: see text] oxide material. Moreover, it is also revealed that there is a significant growth in the values of key analog and RF figures of merits with respect to high-[Formula: see text] values. This analysis suggested that use of a suitable value of high-[Formula: see text]-valued oxide material in InAlN/GaN heterostructure underlap DG MOS-HEMTs can be one of the alternatives for future high speed and microwave applications.
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