Abstract
A systematic and comprehensive study concerning the solid-state reaction between Ni0.9Co0.1 and Ge0.9Sn0.1 layers was carried out. Special attention was paid on the impact of adding 10 at.% of Co in the Ni metallization layer. In-situ X-ray Diffraction (XRD), atomic force microscopy (AFM) and Sheet resistance (Rsh) measurements were performed in order to follow the solid-state reaction, surface morphology and electrical properties evolution, as the temperature increases.
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