IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors

This paper reviews the current state of conductive adhesive technology. Most work to date has been carried out with isotropically-conductive adhesives which conduct electricity in any direction. In this review, particular attention has been paid to recently-developed anisotropically-conductive adhesives which are electrically conductive along one axis only. Patents filed in this area have been surveyed and the key points relating to the technology employed are summarized. A survey of the market was carried out and is presented. Adhesive processing techniques were studied and reliability issues relating to adhesives in general and to conductive adhesives in particular investigated. Voids in the adhesive leading to reduced adhesion and stress concentration were seen to be an area of concern while the effect of moisture leading to increased joint resistance and reduced strength was concluded to be the key limiting factor in the long-term reliability of conductive adhesives.

Journal of Electronics ManufacturingVol. 05, No. 04, pp. 273-276 (1995) Papers from The International Seminar on Latest Achievements in Conductive Joining in Electronics Packaging, Philips, Eindhoven, The Netherlands, September 1995No AccessFLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMSITSUO WATANABE, KENZO TAKEMURA, NAOYUKI SHIOZAWA, OSAMU WATANABE, KAZUYOSHI KOJIMA and TOMOHISA OHTAITSUO WATANABEShimodate Research Laboratory, Hitachi Chemical Co., Ltd., Shimodate 308, Japan Search for more papers by this author , KENZO TAKEMURAShimodate Research Laboratory, Hitachi Chemical Co., Ltd., Shimodate 308, Japan Search for more papers by this author , NAOYUKI SHIOZAWAShimodate Research Laboratory, Hitachi Chemical Co., Ltd., Shimodate 308, Japan Search for more papers by this author , OSAMU WATANABEShimodate Research Laboratory, Hitachi Chemical Co., Ltd., Shimodate 308, Japan Search for more papers by this author , KAZUYOSHI KOJIMAShimodate Research Laboratory, Hitachi Chemical Co., Ltd., Shimodate 308, Japan Search for more papers by this author and TOMOHISA OHTAShimodate Research Laboratory, Hitachi Chemical Co., Ltd., Shimodate 308, Japan Search for more papers by this author https://doi.org/10.1142/S0960313195000281Cited by:14 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractFlip-chip interconnection to various substrates using ACF was investigated. It was demonstrated that the interconnection resistance of the joints made between gold bumps of the chip and Ni/Au coated pads on FR-4 boards was lower than 10 mΩ depending upon the kinds of conducting particles, although the interconnection was due to the mechanical contact between conducting particles and conductor surfaces. The current–voltage characteristics of the interconnection exhibited an ohmic behavior up to currents of 2000 mA per bump. In attaching bumpless chips to various substrates, the interconnection resistance strongly depended on the kinds of conducting particles and substrates. It was demonstrated that Ni particles were favorable for making good electrical contacts between Al pads of the bumpless chip and substrate electrodes. It was also demonstrated that low interconnection resistance in the range of 2 mΩ to 7 mΩ was obtained as well as with bumped chips, when FR-4 boards with Ni/Au bumped pads were used as substrates for interconnecting bumpless chips.Presented at The International Seminar on Latest Achievements in Conductive Joining in Electronics Packaging, Philips, Eindhoven, The Netherlands, September 1995. FiguresReferencesRelatedDetailsCited By 14Health Monitoring for Electronic Package Using a Simple Moire InterferometryJin-Hyoung PARK and Soon-Bok LEE1 Jan 2008 | Journal of Solid Mechanics and Materials Engineering, Vol. 2, No. 6Electrically Anisotropic Thin Films Consisting of Polymeric and Metallic Nanolayers from Self-Assembled Lamellae of Diblock CopolymersSang-Hyun Yun, Seong Min Yoo, Byeong-Hyeok Sohn, Jin Chul Jung and Wang-Cheol Zin et al.3 March 2005 | Langmuir, Vol. 21, No. 8Ultra Thin Flip Chip InterconnectsJulian Haberland and Christine Kallmayer1 Jan 2004 | Frequenz, Vol. 58, No. 3-4異方導電フィルムを用いたフリップチップ実装技術Itsuo Watanabe20 Mar 2001 | Seikei-Kakou, Vol. 13, No. 3Fundamental studies of isotropic conductive adhesives focused on the current loadability of ICA for flip chip applicationsJ. Haberland, C. Kallmayer, R. Aschenbrenner and H. Reichl1 Jan 2001Reliability of electrically conductive adhesive joints for surface mount applications: a summary of the state of the artJ.C. Jagt1 Jun 1998 | IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, Vol. 21, No. 2Anisotropic conducting adhesives for electronic assemblyDavid C. Whalley, Samjid H. Mannan and David J. Williams1 Mar 1997 | Assembly Automation, Vol. 17, No. 1Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: pt.I. ExperimentA.O. Ogunjimi, S.H. Mannan, D.C. Whalley and D.J. Williams1 Oct 1996 | IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, Vol. 19, No. 4Conductive adhesive flip-chip bonding for bumped and unbumped dieG. Connell, R.L.D. Zenner and J.A. GerberEvaluation of Interposers in the ACF Bonding Process Jun Ge, I. Saarinen and P. SavolainenAdvanced MCM-Ls for consumer electronicsK. Amami, S. Yuhaku, T. Shiraishi, Y. Bessho and K. Eda et al.Anisotropic conductive adhesive films for flip-chip interconnection onto organic substratesA. Nagai, K. Takemura, K. Isaka, O. Watanabe and K. Kojima et al.Reliability of different flex materials in high density flip chip on flex applicationsP. Palm, J. Maattanen, Y. De Maquille, A. Picault and J. Vanfleteren et al.High-density interconnections in mobile phones using ACFP. Savolainen, l. Saarinen and O. Rusanen Recommended Vol. 05, No. 04 Metrics History Received 1 August 1995 Accepted 1 September 1995 PDF download

The Surface Evolver is an interactive program for studying the shapes of liquid surfaces. Recently added features permit the calculation of the Hessian matrix of second derivatives of the energy. The Hessian can be used for fast convergence to an equilibrium, and eigenvalue analysis of the stability of that equilibrium. This paper describes the use of the Hessian by the Surface Evolver, presents some sample stability analyses, and gives some numerical results on the accuracy and convergence of the methods. It is also shown how one can evolve unstable surfaces.

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Journal of Electronics ManufacturingVol. 04, No. 03, pp. 149-154 (1994) No AccessComputer simulation of solder paste flow Part II: Flow out of a stencil apertureS.H. MANNAN, N.N. EKERE, I. ISMAIL, and M.A. CURRIES.H. MANNANDepartment of Aeronautical, Mechanical and Manufacturing Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author , N.N. EKEREDepartment of Aeronautical, Mechanical and Manufacturing Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author , I. ISMAILDepartment of Aeronautical, Mechanical and Manufacturing Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author , and M.A. CURRIEDepartment of Aeronautical, Mechanical and Manufacturing Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author https://doi.org/10.1142/S096031319400016XCited by:17 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractIn this paper we use the computer simulation of dense suspensions introduced in Part I to simulate the flow of solder paste during stencil printing for reflow soldering in surface-mount technology (SMT). In order to understand the results of the simulation better, we first simulate the flow of solder paste between two parallel plates, in an arrangement similar to that found in a parallel plate viscometer. We then proceed to examine the results for flow of paste out of a stencil aperture. The aperture width, height, angle of wall inclination, particle size and concentration of the suspension are all varied to see the effect on tensile stress in the paste, and flow patterns. The most significant effect occurs when the angle of wall inclination is changed, and it is argued that walls should be inclined to reduce paste skipping (i.e. shorts on the reflowed PCB). Insight is gained into the phenomenon of skipping in general.Keywords:Solder pasteSMTdense suspensionscomputer simulation FiguresReferencesRelatedDetailsCited By 17Particle Level Modelling of Solder Pastes Rheological Behaviour in Viscosity MeasurementTareq Al-Ma'aiteh and Oliver Krammer1 May 2019Rheological Characterisation and Empirical Modelling of Lead-Free Solder Pastes and Isotropic Conductive Adhesive PastesR. Durairaj, Lam Wai Man, S. Ramesh and S. W. Dean1 Jan 2010 | Journal of ASTM International, Vol. 7, No. 7Rheological characterisation and printing performance of Sn/Ag/Cu solder pastesR. Durairaj, S. Ramesh, S. Mallik, A. Seman and N. Ekere1 Oct 2009 | Materials & Design, Vol. 30, No. 9Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assemblyR. Durairaj, S. Mallik, A. Seman, A. Marks and N.N. Ekere1 Apr 2009 | Journal of Materials Processing Technology, Vol. 209, No. 8Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assemblyR. Durairaj, S. Mallik, A. Seman, A. Marks and N.N. Ekere1 Nov 2008Solder paste characterisation: towards the development of quality control (QC) toolR. Durairaj, S. Mallik and N.N. Ekere27 Jun 2008 | Soldering & Surface Mount Technology, Vol. 20, No. 3Analysis of jamming networks in sheared suspensionsSimon R. Hillman and Samjid H. Mannan1 May 2006 | Journal of Rheology, Vol. 50, No. 3Understanding the process window for printing lead-free solder pastesT.A. Nguty, B. Salam, R. Durairaj and N.N. Ekere1 Oct 2001 | IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4Critical factors affecting paste flow during the stencil printing of solder pasteR. Durairaj, T.A. Nguty and N.N. Ekere1 Aug 2001 | Soldering & Surface Mount Technology, Vol. 13, No. 2Analysis of Solder Paste Release in Fine Pitch Stencil Printing ProcessesG. Rodriguez and D. F. Baldwin1 September 1999 | Journal of Electronic Packaging, Vol. 121, No. 3Effective modeling of the reflow soldering process: use of a modeling tool for product and process designF. Sarvar and P.P. Conway1 Jul 1998 | IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, Vol. 21, No. 3Understanding the process window for printing lead-free solder pastesT.A. Nguty, S. Budiman, D. Rajkumar, R. Solomon and N.N. Ekere et al.Simulation of the stencil printing process [solder pastes]G.P. Glinski, C. Bailey and K. PericleousSolder paste printing process modelling mapN.N. Ekere, S.H. Mannan and M.A. CurrieThe study of the response of solder pastes under sinusoidal vibrationD. He, N.N. Ekere and M.A. CurrieAn investigation into the printing characteristics and mechanical dynamics of advanced squeegee mechanismsM. Howarth, S.A. Silvester, M. Lacey and K. SivaygonathanCorrelating solder paste composition with stencil printing performanceT.A. Nguty, N.N. Ekere and A. Adebayo Recommended Vol. 04, No. 03 Metrics History Received 1 August 1994 Accepted 1 August 1994 KeywordsSolder pasteSMTdense suspensionscomputer simulationPDF download

Journal of Electronics ManufacturingVol. 03, No. 01, pp. 25-29 (1993) PAPERSNo AccessExperimental study of stencil/substrate separation speed in on-contact solder paste printing for reflow solderingN. N. EKERE, I. ISMAIL, E. K. LO and S. H. MANNANN. N. EKEREDepartment of Aeronautical and Mechanical Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author , I. ISMAILDepartment of Aeronautical and Mechanical Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author , E. K. LODepartment of Aeronautical and Mechanical Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author and S. H. MANNANDepartment of Aeronautical and Mechanical Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author https://doi.org/10.1142/S0960313193000048Cited by:9 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractThe paper reports on an experimental study on solder paste printing in which the speed of separation between stencil and substrate was varied and the resulting prints were examined for height and defects. The main conclusion of the study is that the speed of separation does not significantly affect the number of printing defects for some solder pastes whereas for others a very low value of separation speed results in more defects. These differing responses reflect the differing solder particle size distributions and chemical structures of the four solder pastes tested. The flow behaviour of the pastes is a crucial factor in determining defect rates.Keywords:Surface mount technologysolder paste printingstencil/substrate separation speed FiguresReferencesRelatedDetailsCited By 9Stencil printing of adhesive-based fuel cell sealings: The influence of rheology on bubble formation during the separation stepFabiano I Indicatti, Michael Rädler, Friedhelm Günter, Elisabeth Stammen and Klaus Dilger24 September 2022 | Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, Vol. 542Rheological Characterisation and Empirical Modelling of Lead-Free Solder Pastes and Isotropic Conductive Adhesive PastesR. Durairaj, Lam Wai Man, S. Ramesh and S. W. Dean1 Jan 2010 | Journal of ASTM International, Vol. 7, No. 7Correlation between jamming and skipping during solder paste printingS.R. Hillman, S.H. Mannan, R. Durairaj, A. Seman and N.N. Ekere et al.1 Dec 2005 | Soldering & Surface Mount Technology, Vol. 17, No. 4Neural network modeling with confidence bounds: a case study on the solder paste deposition processS.L. Ho, M. Xie, L.C. Tang, K. Xu and T.N. Goh1 Oct 2001 | IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4Characterization of a solder paste printing process and its optimizationGary K.K. Poon and D.J. Williams1 Dec 1999 | Soldering & Surface Mount Technology, Vol. 11, No. 3Analysis of Solder Paste Release in Fine Pitch Stencil Printing ProcessesG. Rodriguez and D. F. Baldwin1 September 1999 | Journal of Electronic Packaging, Vol. 121, No. 3Squeegee deformation study in the stencil printing of solder pastesS.H. Mannan, N.N. Ekere, I. Ismail and E.K. Lo1 Sep 1994 | IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, Vol. 17, No. 3Process Modelling Maps for Solder Paste PrintingN.N. Ekere, E.K. Lo and S.H. Mannan1 Feb 1994 | Soldering & Surface Mount Technology, Vol. 6, No. 2A study of solder paste flow inside a sealed printing headD. He and N.N. Ekere Recommended Vol. 03, No. 01 Metrics History Received 1 September 1992 Accepted 1 October 1992 KeywordsSurface mount technologysolder paste printingstencil/substrate separation speedPDF download

IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors

The IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment. The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE PSPB Operations Manual (sections 8.2.1.C & 8.2.2.A). Each published article was reviewed by a minimum of two independent reviewers using a single-anonymous peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance. Corresponding authors from low-income countries are eligible for waived or reduced open access APCs. The technical content of articles should be both new and significant. Experimental data should be complete and include sufficient descriptions of experimental apparatus, methods, and relevant experimental conditions. Original, unpublished articles are preferred. However, an article presented at a conference or published in a limited-circulation journal or proceedings may be considered for this TRANSACTIONS if the topic warrants and previous circulation does not substantially duplicate that of this TRANSACTIONS. For articles presented at a conference, the author should do the following. 1) Make significant additions/modification to the article. This could include: new data and detailed analysis of the experimental results; addition of references to the previous work of others (not previous work by the authors); a discussion of the previous work and how the author's work expands or builds on it: a discussion of how the author's results compare/contrast the previous work; etc. 2) Reference the previously published article in the reference section (this is an IEEE requirement). 3) Change the title to reflect the fact that the article has been "significantly" modified.

The IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment. The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE PSPB Operations Manual (sections 8.2.1.C & 8.2.2.A). Each published article was reviewed by a minimum of two independent reviewers using a single-anonymous peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance. Corresponding authors from low-income countries are eligible for waived or reduced open access APCs. The technical content of articles should be both new and significant. Experimental data should be complete and include sufficient descriptions of experimental apparatus, methods, and relevant experimental conditions. Original, unpublished articles are preferred. However, an article presented at a conference or published in a limited-circulation journal or proceedings may be considered for this TRANSACTIONS if the topic warrants and previous circulation does not substantially duplicate that of this TRANSACTIONS. For articles presented at a conference, the author should do the following. 1) Make significant additions/modification to the article. This could include: new data and detailed analysis of the experimental results; addition of references to the previous work of others (not previous work by the authors); a discussion of the previous work and how the author's work expands or builds on it: a discussion of how the author's results compare/contrast the previous work; etc. 2) Reference the previously published article in the reference section (this is an IEEE requirement). 3) Change the title to reflect the fact that the article has been "significantly" modified.

IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors

IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors

IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors

The IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment. The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE PSPB Operations Manual (sections 8.2.1.C & 8.2.2.A). Each published article was reviewed by a minimum of two independent reviewers using a single-anonymous peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance. Corresponding authors from low-income countries are eligible for waived or reduced open access APCs. The technical content of articles should be both new and significant. Experimental data should be complete and include sufficient descriptions of experimental apparatus, methods, and relevant experimental conditions. Original, unpublished articles are preferred. However, an article presented at a conference or published in a limited-circulation journal or proceedings may be considered for this TRANSACTIONS if the topic warrants and previous circulation does not substantially duplicate that of this TRANSACTIONS. For articles presented at a conference, the author should do the following. 1) Make significant additions/modification to the article. This could include: new data and detailed analysis of the experimental results; addition of references to the previous work of others (not previous work by the authors); a discussion of the previous work and how the author's work expands or builds on it: a discussion of how the author's results compare/contrast the previous work; etc. 2) Reference the previously published article in the reference section (this is an IEEE requirement). 3) Change the title to reflect the fact that the article has been "significantly" modified.

The IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment. The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE PSPB Operations Manual (sections 8.2.1.C & 8.2.2.A). Each published article was reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance. Corresponding authors from low-income countries are eligible for waived or reduced open access APCs. The technical content of articles should be both new and significant. Experimental data should be complete and include sufficient descriptions of experimental apparatus, methods, and relevant experimental conditions. Original, unpublished articles are preferred. However, an article presented at a conference or published in a limited-circulation journal or proceedings may be considered for this TRANSACTIONS if the topic warrants and previous circulation does not substantially duplicate that of this TRANSACTIONS. For articles presented at a conference, the author should do the following. 1) Make significant additions/modification to the article. This could include: new data and detailed analysis of the experimental results; addition of references to the previous work of others (not previous work by the authors); a discussion of the previous work and how the author's work expands or builds on it: a discussion of how the author's results compare/contrast the previous work; etc. 2) Reference the previously published article in the reference section (this is an IEEE requirement). 3) Change the title to reflect the fact that the article has been "significantly" modified.

IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors