Abstract
Thermal management of high-power light-emitting diodes (LEDs) plays an important role in determining their optical properties, reliability, and lifetime. In this paper, we present a method to study the temperature field of phosphor-converted LED packages by combining the Monte Carlo optical simulation and finite element simulation together. The temperature field, including the heat generation in both LED chip and phosphor layer, are presented and analyzed. It was found that temperature increased with the increase in phosphor concentration and the hotspot location in remote phosphor-coating packages shifted with the changes in phosphor concentration, while there was no shift in direct phosphor-coating packages. It was concluded that the hotspot location in the high-power phosphor-converted white LED packages depended on phosphor concentrations as well as packaging methods.
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