Abstract
On the basis of homogeneous liquid-liquid extraction (HoLLE) with Zonyl FSA to plating water containing 1 mg palladium, 96.6% of the palladium was extracted into the sedimented liquid phase. After phase separation, the volume ratio (Va/Vs) of the aqueous phase (Va) and the sedimented liquid phase (Vs) was 556 (50 mL → 0.09 mL). The assessment of the potential implementation of this procedure to wastewater treatment showed that HoLLE was satisfactorily achieved when the volume was scaled up to 1000 mL. Moreover, HoLLE was conducted to real palladium plating wastewater generated in the plating industry. 94.5% of the palladium was extracted into the sedimented liquid phase. After phase separation, the volume ratio (Va/Vs) of the aqueous phase (Va) and the sedimented liquid phase (Vs) was 500 (50 mL → 0.1 mL). In addition, HoLLE could separate palladium from coexisting metals in real plating wastewater. This knowledge is expected to lead to the development of new separation and concentration technologies of rare metals from real plating wastewater.
Highlights
The multi-functionalization and miniaturization of electronic devices is accompanied by a growing density of their components
The performance of Homogeneous Liquid-Liquid Extraction (HoLLE) was evaluated for a palladium-ammine complex in weakly acidic aqueous media using Zonyl FSA
On the basis of palladium-ammine complex, phase separation was satisfactorily completed by HoLLE in weakly acidic aqueous media
Summary
The multi-functionalization and miniaturization of electronic devices is accompanied by a growing density of their components. (2016) Homogeneous Liquid-Liquid Extraction (HoLLE) of Palladium in Real Plating Wastewater for Recovery. Gold plating is widely implemented in wiring and contact materials in the electronic industry because it provides excellent corrosion resistance and electric conductivity [1] [2]. The need for cost reducing approaches has prompted researchers to seek substitutes for gold plating. Plating processes using palladium and its alloys have been applied to electronic materials since the 1960s [3] [4]. Palladium plating provides superior chemical and mechanical properties that fulfill the characteristic requirements for the surface treated electronic components [5]-[7]
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