Abstract
AbstractA fast and wide deflection silicon‐resonant torsional optical scanner driven by a piezoelectric actuator has been developed and patented. The scanner is composed of a 1‐mm square mirror and two pairs of torsion beams and arms fabricated using microelectromechanical system (MEMS) processing of a silicon‐on‐insulator (SOI) wafer. According to calculations, at the same resonant driving frequency, the maximum principal stress of this structure was about one‐third smaller than that of the usual structure having one pair of torsion beams. We achieved high frequency scanning of the optical beam with a large angular deflection up to 54° at 38 kHz with a 5 V peak‐to‐peak applied voltage using the bulk piezoelectric stack actuator, and up to 17° at 38 kHz with a 25 V peak‐to‐peak voltage using the unimorph actuator of a zinc oxide (ZnO) thin film. These results show that this scanner has the ability to perform the horizontal scanning for high‐resolution extended graphics array (XGA) or super extended graphics array (SXGA) laser display. Copyright © 2010 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.
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