Abstract
We employ manipulated ultrafast laser pulses to realize microprocessing with high-performance. Efficient microwelding of glass substrates by irradiation by a double-pulse train of ultrafast laser pulses is demonstrated. The bonding strength of two photostructurable glass substrates welded by double-pulse irradiation was evaluated to be 22.9 MPa, which is approximately 22% greater than that of a sample prepared by conventional irradiation by a single pulse train. Additionally, the fabrication of hollow microfluidic channels with a circular cross-sectional shape embedded in fused silica is realized by spatiotemporally focusing the ultrafast laser beam. We show both theoretically and experimentally that the spatiotemporal focusing of ultrafast laser beam allows for the creation of a three-dimensionally symmetric spherical peak intensity distribution at the focal spot.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
