Abstract
AbstractThe systematic investigation on the thermal stability of the CoO layer was carried out for various electrode materials. When Pt with higher oxygen potential (Gibbs free energy change of the oxidation reaction) compared to Co is used as electrodes, the resistance of the Pt/CoO/Pt devise was severely decreased by the post deposition annealing (PDA) process and the resistance switching into the high resistance state was observed in the first voltage sweep. This indicants that the reducing Ar ambient induces the quite local reduction of CoO. The reduction of the CoO layer is also expected even with the Co electrode, which is reasonably attributed to the oxygen concentration gradient at the Co/CoO interface in the Co/CoO/Pt device. With the Ti electrode having a much lower oxygen potential than Co, the reduction of CoO by Ti is also indicated electrically in the Pt/CoO/Ti device. On the other hands, W electrodes which is thought to have the solid-solution oxygen can stabilize the CoO layer during PDA although W is more affinitive with oxygen compared with Co. It can be pointed out the oxygen delivery at the electrode/oxide layer interface is a critical factor in designing the thermally stable stacking structure for resistance random access memory.
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