Abstract
A modified process condition has been proposed for the growth of high-quality 6-inch 4H-SiC single crystal. Temperature gradient (dT[°C] = Tbottom-Tupper) was controlled by changing coil position in order to investigate the effect of the temperature gradient on the SiC crystal quality. SiC ingot surface and etch pit density (EPD) of etched SiC wafer were investigated according to different dT conditions at the initial stage of SiC crystal growth. The surface of SiC crystal ingots grown with different dT for 10h were observed by OM and etched SiC wafers were prepared from SiC crystal ingots after main growth step for 100h. Different dT conditions in the initial growth stage resulted in dramatically different surface images and the crystal quality evaluated by EPD.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
