Abstract
We have realized millimeter-size rf inductors on silicon using a polyimide mold–copper electroplating coil technology. Subsequently, the coils are assembled with magnetic cover plates of commercially available bulk Ni–Zn ferrites of high resistivity. Using the magnetic flux-amplifying ferrite plates, we obtain a 40% enhancement of the inductance and a 25% enhancement of the quality factor (Q=10–20) for frequencies up to 0.2 GHz. Our results indicate the large potential of using bulk ferrites for rf applications in a hybrid inductor assembly process.
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