Abstract

Radiation from high-power fast-pulsed lasers is being used in the engineering and the investigation of low-dimensional semiconductor structures and devices. In all laser involved processes, heat is supplied to the material in very small localised areas at ultra-fast rates and is believed to obey the hyperbolic heat conduction. A Transmission Line Matrix (TLM) solution is developed to account for the heat wave propagation in the low dimensional thin film. A good agreement is found between the TLM and analytical results. The present results also show that pulsed laser thermal waves can be used in the analysis of subsurface properties such as defects, thickness distribution and the thermal nature of interfaces.

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