Abstract
Electron mobility of N-type (100) plane silicon films 1 µm thick on (11̄02) sapphire substrate has been investigated associating with the growth rate. High electron mobility, near 600 cm2V-1s-1, has been achieved at 10∼20 µ/min high growth rate. Dislocation etch pits and stacking fault patterns have been revealed by the newly developed chemical etching. The dislocation density decreases at low growth rate region (<2 µ/min) with increasing growth rate. At high growth rate, more than 10 µ/min, stacking fault density decreases. The in-depth profiles of auto-doped aluminum have been obtained by the ion mass spectrometry. As a result, mobility enhancement at the high growth rate is assigned to stacking fault decrements in the films.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.