Abstract
Rare-earth ion doped potassium yttrium double tungstate, RE:KY(WO4)2, is a promising candidate for small, power-efficient, on-chip lasers and amplifiers. There are two major bottlenecks that complicate the realization of such devices. Firstly, the anisotropic thermal expansion coefficient of KY(WO4)2 makes it challenging to integrate the crystal on glass substrates. Secondly, the crystal layer has to be, for example, <1 µm to obtain single mode, high refractive index contrast waveguides operating at 1550 nm. In this work, different adhesives and bonding techniques in combination with several types of glass substrates are investigated. An optimal bonding process will enable further processing towards the manufacturing of integrated active optical KY(WO4)2 devices.
Highlights
Potassium yttrium double tungstate (KY(WO4)2) is a promising candidate for on-chip lasers and amplifiers
KY(WO4)2 has to be grown on a lattice matched substrate, i.e., growth of slightly doped KY(WO4)2 on an undoped KY(WO4)2 seed substrate by liquid phase epitaxy (LPE) [5,6], which makes this method not suitable for the integration of the material on amorphous substrates
The KY(WO4)2 sample has a large (∼250-650%) thermal expansion coefficient (CTE) mismatch with the glass substrate, which gives restrictions on the thermal budget that can be used during the integration process
Summary
Potassium yttrium double tungstate (KY(WO4)2) is a promising candidate for on-chip lasers and amplifiers. The crystal provides large emission and absorption cross-sections for rare-earth ions doped into the material [3]. Its crystalline structure is advantageous to achieve excellent gain characteristics when doped with rare-earth ions, which is needed for the realization of lasers and amplifiers. KY(WO4) has to be grown on a lattice matched substrate, i.e., growth of slightly doped KY(WO4) on an undoped KY(WO4) seed substrate by liquid phase epitaxy (LPE) [5,6], which makes this method not suitable for the integration of the material on amorphous substrates. The KY(WO4) sample has a large (∼250-650%) thermal expansion coefficient (CTE) mismatch with the glass substrate, which gives restrictions on the thermal budget that can be used during the integration process
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