Abstract
Heat dissipation and thermal management are central challenges in various areas of science and technology and are critical issues for the majority of nanoelectronic devices. In this review, we focus on experimental advances in thermal characterization and phonon engineering that have drastically increased the understanding of heat transport and demonstrated efficient ways to control heat propagation in nanomaterials. We summarize the latest device-relevant methodologies of phonon engineering in semiconductor nanostructures and 2D materials, including graphene and transition metal dichalcogenides. Then, we review recent advances in thermal characterization techniques, and discuss their main challenges and limitations.
Highlights
Advances in the electronics industry have led to an increased need for novel approaches to thermal management to improve devices performance and reliability, by controlling the dissipation of the energy generated in the devices
We have presented an overview of recent strategies for engineering the heat transport by phonons that have been applied to possible technologically-relevant materials, such as semiconductor nanostructures, like nanowires, superlattices, phononic crystals, and 2D
Progress in material growth and fabrication has enabled the emergence of a vibrant research area of heat transport at the nanoscale, which presents a myriad of exciting phenomena such as access to thermal transport regimes beyond diffusive transport, i.e., ballistic and hydrodynamic [209,210], and to fundamental aspects of the heat transport that open new technical prospects such as ballistic cooling [211]
Summary
Advances in the electronics industry have led to an increased need for novel approaches to thermal management to improve devices performance and reliability, by controlling the dissipation of the energy generated in the devices. The possibility of controlling heat propagation by engineering the phononic properties of the fundamental components is of great interest in nanoelectronics—where heat dissipation will play a major role in determining the performance of high-density nanoscale circuits —or in thermoelectric materials—where materials with low thermal conductivities are desired. The main heat carriers in these materials are phonons, understanding and controlling phonon transport are issues highly connected with the successful development of low-power electronics and efficient thermoelectric energy harvesting. The concept of phonon engineering has been employed in various nanomaterials during recent decades, showing its potential in thermal management. We review recent works that have demonstrated efficient ways to control heat conduction in nanomaterials by phonon engineering, focusing on semiconductor conduction in nanomat nanostructures nanostructures and mainly two-dimensional and two-dimensional materials.
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