Abstract
In the framework of the AEgIS project a series of steady state and dynamic heat transfer measurements at ultra-low temperatures was conducted in the Central Cryogenic Laboratory at CERN. Two sandwich setups, simulating the behaviour of ultra-cold AEgIS electrodes, were investigated and compared, namely: a sapphire — indium — copper and a sapphire — titanium — gold — indium — copper sandwich. The total thermal resistivity of both sandwich setups was evaluated as a function of the influence of normal and superconducting thin layers and multiple dielectric — metallic interfaces in terms of Kapitza resistance. The resulting limitations of the electrode’s design are presented.
Highlights
The ultra-cold electrodes forming a Penning trap in the AEgIS (Antimatter Experiment: Gravity, Interferometry, Spectroscopy) experiment at CERN [1] should be cooled-down to below 100 mK
In the framework of the AEgIS project a series of steady state and dynamic heat transfer measurements at ultra-low temperatures was conducted in the Central Cryogenic Laboratory at CERN
The total thermal resistivity of both sandwich setups was evaluated as a function of the influence of normal and superconducting thin layers and multiple dielectric − metallic interfaces in terms of Kapitza resistance
Summary
The ultra-cold electrodes forming a Penning trap in the AEgIS (Antimatter Experiment: Gravity, Interferometry, Spectroscopy) experiment at CERN [1] should be cooled-down to below 100 mK. Such a low temperature is necessary to diminish the thermal movement of the particles to achieve the planned measurement precision of 1 %. Some of the electrodes have to be divided into 4 separate sectors, creating the required quadrupole electric field. The fact, that the electrodes should be on the one hand sufficiently thermally conductive to remain at a temperature below 100 mK, and on the other hand completely electrically insulated, is a huge engineering challenge. The electrodes are proposed to be made by depositing golden sectors on a base of a sapphire crystal
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More From: IOP Conference Series: Materials Science and Engineering
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