Abstract
Properties of silicon (M-Si) prepared by the Czochralski growth technique in a vertical magnetic field of 0.05 T applied to a melt are studied by measuring IR absorption spectra, microindentation, and selective etching. The effect of increasing the concentration of interstitial oxygen upon the thermal treatment of M-Si is found. It is shown that microhardness of M-Si is higher than that of silicon grown by the traditional Czochralski technique by ∼8%. The features in the behavior of M-Si are attributed to the formation of oxygen-containing defect-impurity complexes during the growth. Upon thermal treatment at 900°C in the hydrogen flow, these complexes decompose with the extraction of interstitial oxygen, which suppresses thermal hardening typical of the silicon single crystals grown by the traditional Czochralski technique.
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