Abstract
The growth of high purity GaAS with excellent uniformity and very low defect density by chemical beam epitaxy using triethylgallium and arsine is described. The residual background impurity is mostly carbon. A mobility of 518 cm2/Vs with a hole density of 3.6 x 1014 cm−3 has been obtained for a growth temperature of 500° C. The electrical quality is further evaluated by fabricating a Si doped epilayer into MESFET device using 1 μm gate length. A transconductance of 177 mS/mm has been measured. The results indicate that chemical beam epitaxy is a very attractive growth technique for GaAs integrated circuits.
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