Abstract
A chemical method was developed to remove the gold (Au) seed particles from the tips of solution-liquid-solid (SLS) grown silicon (Si) nanorods. The nanorods are capped with hydrophobic ligands during the synthesis, which made it necessary to perform the Au etching in an aqua regia and chloroform emulsion. Preliminary etching experiments revealed that a thin Si shell coated the Au seeds and prevented Au removal. Therefore, a rapid thermal quench of the reaction mixture was needed to crack this shell and provide etchant access to the Au seed. More than 95% of the Au seeds could be removed from the tips of thermally quenched samples without damaging the crystalline Si nanorods.
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